Quality Management & Training
Quality Management & Training
Available either as a book or CD Rom Adobe Acrobat pdf file
Note: The book contents are also delivered in QM&T’s Soldering Quality training course
Ever had problems with soldering? Want to explain to operators, solders or suppliers the exact quality standard you expect and require? Want to demonstrate to the quality improvement team the soldering quality standard expected? Want to show exactly what good and possibly more importantly what bad soldering looks like? Then this is the book for you.
The popularity of the Slide Sets as an aid in the inspection of soldered printed circuit boards and joints on assemblies, has led to a number of these slides being reproduced as colour photographs in the present booklet. It is intended that these will constitute an easily accessible reference guide to good and defective solder wetting and joints produced by mass soldering operations. As such they may be used to teach personnel concerned with the design, production and inspection of soldered printed circuit assemblies some of the defects that may arise during mass soldering as well as t o illustrate the appearance of high quality soldered joints; they may also be put to practical use on the work-bench as a reference guide in assessing acceptability of soldered assemblies.
Quality Control
The production of mass-soldered printed circuit assemblies of high reliability requires the application of a carefully planned quality control scheme, whether the final product is destined for the entertainment or the domestic appliance market where economics are a major factor, or for applications such as telephone systems, computers, railway signalling, aerospace and defence operations in which maximum reliability is an overriding factor. This booklet is directed towards the final production stage of inspection of the completed soldered assembly, after all the necessary controls have been exercised on the production line. In order to obtain the maximum number of perfect soldered joints, consideration must be given to the mechanical design and geometry of the soldered joints, to the selection of a solder alloy suitable for the proposed service stress and temperature conditions, and to the selection of suitable, readily solderable finishes for all component parts comprising the soldered joints. In addition, solderability testing of the parts to be soldered must be carried out prior t o their utilisation on the production line, and adequate consideration given to the selection of the flux, the temperature-time cycle during soldering, and maintenance of the solder bath composition. The quality of the final soldered joints will be sacrificed if these aspects are ignored in order to facilitate some other part of the production process.
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